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Papers presented at the 'Fracture and Reliability' symposium of Euromat 2011: Editorial comments

机译:在Euromat 2011的“断裂与可靠性”研讨会上发表的论文:编辑评论

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摘要

One of the major issues in the use of ceramics, not only for structural but also for functional applications, is their resis?tance to fracture and their reliability. In the electronics industry, for example, ceramics are used because of their specific elec?trical properties. With the quest towards smaller and smaller micro-devices, ceramic components often in contact with met?als may be subjected to significant stresses due to stiffness and thermal expansion mismatches, and failure occurs at the metal-ceramic interface or inside the ceramic phase.
机译:不仅在结构上而且在功能上使用陶瓷的主要问题之一是其抗断裂性和可靠性。例如,在电子工业中,由于其特定的电特性而使用陶瓷。为了寻求越来越小的微型设备,经常与金属接触的陶瓷部件由于刚度和热膨胀失配而可能承受很大的应力,并且在金属-陶瓷界面或陶瓷相内部发生破坏。

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