首页> 外文期刊>Journal of the European Ceramic Society >Effect of SiC nanowires on the thermal shock resistance of joint between carbon/carbon composites and Li_2O-Al_2O_3-SiO_2 glass ceramics
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Effect of SiC nanowires on the thermal shock resistance of joint between carbon/carbon composites and Li_2O-Al_2O_3-SiO_2 glass ceramics

机译:SiC纳米线对碳/碳复合材料与Li_2O-Al_2O_3-SiO_2玻璃陶瓷之间的接缝的抗热震性的影响

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摘要

In order to improve the bonding property of joint between SiC modified carbon/carbon (C/C) composites and Li_2O-Al_2O_3-SiO_2 (LAS) glass ceramics, SiC nanowires were attempted as the reinforcement materials in the interface region of SiC transition layer and Li_2O-MgO-Al_2O_3-SiO_2 (LMAS) gradient joining interlayer. The C/C-LAS joint with SiC nanowire-reinforced interface layer was prepared by a three-step technique of pack cementation, in situ reaction and hot-pressing. The microstructure and thermal shock resistance of the as-prepared joints were examined. The average shear strength of the joined samples with SiC nanowires increased from 24.9 MPa to 31.6 MPa after 40 thermal cycles between 1000 ℃ and room temperature, while that of the joined samples without SiC nanowires dropped from 21.4 MPa to 8.3 MPa. The increase of thermal shock resistance of the C/C-LAS joints was mainly attributed to the toughening mechanism of SiC nanowires by pullout, bridging and crack deflection.
机译:为了提高SiC改性碳/碳复合材料与Li_2O-Al_2O_3-SiO_2(LAS)玻璃陶瓷之间的结合性能,人们尝试了SiC纳米线作为SiC过渡层界面区域的增强材料。 Li_2O-MgO-Al_2O_3-SiO_2(LMAS)梯度连接中间层。通过三步骤的填充胶结,原位反应和热压技术制备了具有SiC纳米线增强界面层的C / C-LAS接头。检查了所制备接头的微观结构和抗热震性。在1000℃和室温之间的40个热循环后,具有SiC纳米线的接合样品的平均剪切强度从24.9 MPa增加到31.6 MPa,而没有SiC纳米线的接合样品的平均剪切强度从21.4 MPa降至8.3 MPa。 C / C-LAS接头抗热震性的提高主要归因于SiC纳米线通过拉拔,桥接和裂纹变形的增韧机理。

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