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首页> 外文期刊>Journal of the European Ceramic Society >Electrical resistivity of silicon nitride-silicon carbide based ternary composites
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Electrical resistivity of silicon nitride-silicon carbide based ternary composites

机译:氮化硅-碳化硅基三元复合材料的电阻率

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摘要

New electrically conductive ternary composites were developed by adding 8 vol.% of ZrN or ZrB_2 to a Si_3N_4-SiC matrix. During hot pressing, ZrB_2 reacted with S13N4 to form ZrSi_2, ZrN, Si and BN whereas added ZrN did not undergo any reactions in the Si_3N_4-SiC-ZrN composite. The composites modified by ZrN or ZrB_2 addition showed a lower resistivity (7 × 10~3 Ω cm and 3 × 10~(-1) Ω cm) compared to the matrix (3 × 10~4 Ω cm). Further studies on the grain size distribution and the volume ratio of conducting and non-conducting phases excluded a percolation network of ZrN and ZrSi_2 grains. In fact, doping of SiC grains and modified grain boundaries as a consequence of the formation of liquid phases during sintering are suggested to be the reason for the significantly lower resistivity of materials containing ZrSi2.A decrease in the composite resistivity due to a subsequent heat treatment was obtained for all hot-pressed composites.
机译:通过将8%(体积)的ZrN或ZrB_2添加到Si_3N_4-SiC基质中,开发了新的导电三元复合材料。在热压过程中,ZrB_2与S13N4反应形成ZrSi_2,ZrN,Si和BN,而添加的ZrN在Si_3N_4-SiC-ZrN复合材料中未发生任何反应。与基质(3×10〜4Ωcm)相比,添加ZrN或ZrB_2改性的复合材料显示出较低的电阻率(7×10〜3Ωcm和3×10〜(-1)Ωcm)。对导电性和非导电相的晶粒尺寸分布和体积比的进一步研究排除了ZrN和ZrSi_2晶粒的渗流网络。实际上,由于在烧结过程中形成液相导致了SiC晶粒的掺杂和晶界的改变,这被认为是含ZrSi2的材料的电阻率大大降低的原因。由于随后的热处理,复合电阻率降低了对于所有热压复合材料均获得。

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