Effect of Wheat Straw Pretreatments and Glue Formulations on Particle Board Properties

摘要

In this paper, the effect of wheat straw (WS) pretreatments and glue formulations on mechanical (i.e. Compressive Strength (CS) and Impact Strength (IS)) and water resistance properties (i.e. Thickness Swelling (TS) and water absorption (WA)) of particle board have been investigated and the results have been compared with conventional wooden particleboard . Wheat straw was treated with steam available at 110°C and 20 psig, for the retention time of 5, 10 and 15 min. The solution of 10% HO was also used for removing the lignin. Particleboard was prepared by bonding treated WS with four types of glue recipes of synthetic and natural binders like urea formaldehyde (UF), polyvinyl acetate (PVA), corn flour (CF) and wheat flour (WF). The particle board was formed at the hydraulic pressure and temperature of 2800 psig and 80°C respectively. It was observed that WS particleboard has low mechanical strength and high water resistance in comparison with conventional board. The particle board prepared with HCl cured wheat straw and glue having high urea formaldehyde and corn flour has higher CS and IS as well as low TS and WA. It may be concluded that wheat straw is a good substitute of wood for particle board while using HC1 as a modifying chemical and strong binders like urea formaldehyde and com flour.