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TSV: A novel energy efficient Memory Integrity Verification scheme for embedded systems

机译:TSV:适用于嵌入式系统的新型节能存储完整性验证方案

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摘要

Embedded systems are ubiquitous in this era of portable computing. These systems are empowered to access, store and transmit abundance of critical information. Thus their security becomes a prime concern. Moreover, most of these embedded devices often have to operate under insecure environments where the adversary may acquire physical access. To provide security, cryptographic security mechanisms could be employed in embedded systems. However, these mechanisms consume excessive energy that cannot be tolerated by the embedded systems. Therefore with the focus on achieving energy efficiency in cryptographic Memory Integrity Verification (MIV) mechanism, we present a novel energy efficient approach called Timestamps Verification (TSV) to provide Memory Integrity Verification in embedded systems. This paper elaborates the proposed approach along with its theoretical evaluation, simulation results, and experimental evaluation. The results prove that the energy savings in the TSV approach are in the range of 36-81% when compared with traditional MIV mechanisms
机译:在便携式计算时代,嵌入式系统无处不在。这些系统具有访问,存储和传输大量关键信息的能力。因此,它们的安全性成为首要问题。此外,这些嵌入式设备中的大多数通常必须在不安全的环境下运行,敌方可能会获得物理访问权。为了提供安全性,可以在嵌入式系统中采用密码安全性机制。但是,这些机制消耗了嵌入式系统无法承受的过多能量。因此,着重于在加密内存完整性验证(MIV)机制中实现能源效率,我们提出了一种称为时间戳验证(TSV)的新型节能方法,以在嵌入式系统中提供内存完整性验证。本文详细阐述了所提出的方法以及其理论评估,仿真结果和实验评估。结果证明,与传统的MIV机制相比,TSV方法节省的能源在36-81%的范围内

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