首页> 外文期刊>Journal of surface investigation: x-ray, synchrotron and neutron techniques >Temperature-Accelerated Molecular Dynamics Simulation of the Evolution of a Low-Energy Incident Cu3 Cluster on the Cu(100) Surface with a Monoatomic Step
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Temperature-Accelerated Molecular Dynamics Simulation of the Evolution of a Low-Energy Incident Cu3 Cluster on the Cu(100) Surface with a Monoatomic Step

机译:单原子步在Cu(100)表面上低能入射Cu3团簇演化的温度加速分子动力学模拟

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摘要

The molecular dynamics simulation of the normal incidence of a Cu_3 cluster with an energy of 0.2–1 eV/atom on a Cu(100) substrate at an equilibrium temperature of 500–700 K is performed. This substrate contains a rectilinear step, whose height is one atomic layer. After 20-ps relaxation of the atomic cluster on the substrate, its further thermally activated motion on the surface is simulated using the method of temperatureaccelerated molecular dynamics. The Cu_3 cluster mainly demonstrates rotational-translational motion. The time interval between two successive atomic transitions of the cluster is found to be reduced as the distance to the step is decreased.
机译:在平衡温度为500-700 K的条件下,对Cu(100)衬底上能量为0.2-1 eV /原子的Cu_3团簇的法向入射进行了分子动力学模拟。该衬底包含直线台阶,其高度为一个原子层。在衬底上原子团簇松弛20 ps后,使用温度加速分子动力学方法模拟了其在表面上的进一步热激活运动。 Cu_3团簇主要表现出旋转和平移运动。发现簇的两个连续原子跃迁之间的时间间隔随着与台阶的距离减小而减小。

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