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Placement and dimension optimization of shunted piezoelectric patches for vibration reduction

机译:分流压电贴片的放置和尺寸优化以减少振动

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Passive structural vibration reduction by means of shunted piezoelectric patches is addressed in this paper. We present a strategy to optimize, in terms of damping efficiency, the geometry of piezoelectric patches as well as their placement on the host elastic structure. This procedure is based on the maximization of the modal electro-mechanical coupling factor (MEMCF) of the mechanical vibration mode to which the shunt is tuned. To illustrate the method, a general analytical model of a laminated beam is proposed. Two particular configurations are investigated: (i) a beam with two collocated piezoelectric patches connected in series or in parallel to the shunt and (ii) a cantilever beam with one patch. After a modal expansion, original closed-form solutions of the MEMCF are exhibited, which enables to compute optimal values for the placement, length and thickness of the piezoelectric patches that maximize the MEMCF. A dimensionless model is used so that this study can be used to design any smart beam, whatever be its dimensions. More general results about the coupling mechanisms between the piezoelectric patches and the host structure are also raised. In particular, it is found that the patches thickness is an essential parameter and that several configurations are possible, depending on the considered vibration mode. Experiments are also proposed to validate the model.
机译:本文探讨了通过并联压电片的被动结构减振。我们提出了一种在阻尼效率方面优化压电贴片的几何形状及其在主体弹性结构上的放置位置的策略。此过程基于将分流器调谐到的机械振动模式的模态机电耦合因子(MEMCF)最大化。为了说明该方法,提出了层合梁的通用分析模型。研究了两种特定的配置:(i)具有两个并置串联或并联连接至分流器的压电贴片的梁,以及(ii)具有一个贴片的悬臂梁。进行模态扩展后,将显示MEMCF的原始封闭形式解,从而可以计算出最大化MEMCF的压电贴片的位置,长度和厚度的最佳值。使用了无量纲模型,因此该研究可用于设计任何智能光束,无论其尺寸如何。还提出了有关压电贴片和主体结构之间耦合机制的更一般的结果。特别地,发现贴片的厚度是必不可少的参数,并且取决于所考虑的振动模式,几种配置是可能的。还提出了实验以验证模型。

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