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Effects of saccharin and anions (SO42-, Cl-) on the electrodeposition of Co-Ni alloys

机译:糖精和阴离子(SO42-,Cl-)对钴镍合金电沉积的影响

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摘要

The electrodeposition of Co-Ni alloys is investigated to examine the mechanistic effects of chloride, sulfate and saccharin on the resulting alloy composition, deposition current efficiency and partial current densities of the cathodic reactions. When deposition is carried out in chloride, sulfate or mixed sulfate-chloride solutions without saccharin, the influence of hydrogen evolution (HER) becomes dominant and deleterious at higher overpotentials, leading to very low metal deposition current efficiency and the formation of a hydroxide/oxide film on the substrate. This problem is significantly reduced when saccharin is added to the mixed sulfate-chloride plating bath and to a lesser extent the sulfate-only solution. Although saccharin is ineffective in suppressing H+ reduction at low overpotentials, it is very effective at inhibiting H2O reduction at high overpotentials and enabling metal deposition to more easily occur. The system follows anomalous behavior at all current densities both in the absence and presence of saccharin, although it approaches normal behavior as the current density increases toward -1,000 A m(-2) due to Co(II) reduction being mass transfer-controlled.
机译:研究了Co-Ni合金的电沉积,以检验氯化物,硫酸盐和糖精对所得合金成分,沉积电流效率和阴极反应的部分电流密度的机械作用。当在不含糖精的氯化物,硫酸盐或硫酸盐-氯化物混合溶液中进行沉积时,在较高的超电势下,析氢(HER)的影响变得显着而有害,从而导致极低的金属沉积电流效率和氢氧化物/氧化物的形成在基材上的薄膜。当将糖精添加到硫酸盐-氯化物混合镀浴中时,并在较小程度上添加纯硫酸盐溶液时,可以大大减少该问题。尽管糖精不能有效地抑制低过电势下的H +还原,但它非常有效地抑制高过电势下的H2O还原并使金属更容易发生沉积。尽管糖精的存在和不存在,该系统在所有电流密度下都遵循异常行为,尽管由于Co(II)的减少受质量转移控制,电流密度增加至-1,000 A m(-2)时,它接近正常行为。

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