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首页> 外文期刊>Journal of solid state electrochemistry >The effect of emitter geometry on lateral field emission diodes fabricated by AFM-based electrochemical nanolithography
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The effect of emitter geometry on lateral field emission diodes fabricated by AFM-based electrochemical nanolithography

机译:发射极几何形状对基于AFM电化学纳米光刻技术制造的横向场发射二极管的影响

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摘要

Lateral field emission diodes were successfully fabricated using atomic force microscopy (AFM)-based electrochemical nanolithography and tetramethyl ammonium hydroxide (TMAH) wet etching method. Field emission (FE) current of the silicon emitter cathode was measured as a function of the applied anode voltage under vacuum environment. For narrowed nanogaps from 55 to 35 nm, the turn-on voltage was decreased from21 to 16 V. The turn-on voltage of the 35 nm gap was reduced from 16 to 8 V by changing the curvature radius of the cathode tip. The sharper emitter had the lowest turn-on voltage, largest field-enhancement factor, and good stability, which were attributed to the small emitter radius at the cathode tip and very slight changes in the local field factor. These results indicate that the diodes fabricated using this technique had the lowest value of turn-on voltage ever reported for lateral silicon FE devices.
机译:使用基于原子力显微镜(AFM)的电化学纳米平版印刷术和四甲基氢氧化铵(TMAH)湿法刻蚀成功地制造了横向场发射二极管。在真空环境下,测量硅发射极阴极的场发射(FE)电流与所施加阳极电压的关系。对于从55到35 nm的窄纳米间隙,开启电压从21 V降低到16V。通过改变阴极尖端的曲率半径,将35 nm间隙的开启电压从16 V降低到8V。较尖锐的发射极具有最低的导通电压,最大的场增强因子和良好的稳定性,这归因于阴极尖端的发射极半径小和局部场因子的微小变化。这些结果表明,使用这种技术制造的二极管具有迄今为止报道的横向硅FE器件最低的导通电压值。

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