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Microwave curing bismaleimide-triazine composites filled with micro-silica and nano-silica

机译:填充有微二氧化硅和纳米二氧化硅的微波固化双马来酰亚胺-三嗪复合材料

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摘要

A novel composite of bismaleimide-triazine (BT) resins containing 2,2'-diallyl bisphenol A (DABPA) and filled with the mixture of micro- and nano-silica particles were cured by conventional thermal and microwave-assisted process. The dielectric and mechanical properties of BT composites were studied in this paper. The results indicated that the curing method, particle size and content of silica had influences on the dielectric and mechanical properties of BT composites. The dielectric constant and dielectric loss tangent of microwave-cured samples were lower than those of the thermal cured samples because of the different curing mechanism. With the increase of micro-silica content, the dielectric constant of BT composites increased, while the dielectric loss tangent decreased. Due to the decrease of the free volume, the dielectric constant and dielectric loss tangent decreased when the nano-silica particles were incorporated into the composites. In addition, the flexural strength of the BT composites will also be improved by incorporating appropriate amount of micro- and nano-silica particles.
机译:通过常规的热和微波辅助方法,固化了一种新型的含有2,2'-二烯丙基双酚A(DABPA)并填充有微米级和纳米级二氧化硅颗粒混合物的双马来酰亚胺-三嗪(BT)树脂复合物。本文研究了BT复合材料的介电和力学性能。结果表明,固化方法,二氧化硅的粒径和含量对BT复合材料的介电和力学性能有影响。由于固化机理不同,微波固化样品的介电常数和介电损耗正切值低于热固化样品。随着微硅含量的增加,BT复合材料的介电常数增加,而介电损耗角正切减小。由于自由体积的减少,当将纳米二氧化硅颗粒掺入复合物中时,介电常数和介电损耗正切降低。此外,通过掺入适量的微米和纳米二氧化硅颗粒,还将改善BT复合材料的弯曲强度。

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