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Thermophysical properties of undercooled liquid Au-Cu alloys from molecular dynamics simulations

机译:基于分子动力学模拟的过冷液态Au-Cu合金的热物理性质

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The density and the specific heat of liquid Au-Cu alloy above and below the melting temperature are investigated in a wide composition range via constant temperature and constant pressure molecular dynamics simulations. The atomic interaction of the alloy is described with the embedded-atom method (EAM). The equilibrium melting temperature is evaluated from the change in the growth direction of a crystal-liquid sandwich structure under annealing. The simulated density of the Au-Cu alloy increases linearly with decrease of the temperature, whereas the specific heat remains constant over the entire temperature range of 900-1900 K. The excess volume is calculated according to the predicted density of Au-Cu alloy. The negative value of the excess volume and the exponential concentration dependence of the specific heat indicate that the Neumann-Kopp rule does not apply to the Au-Cu binary alloy system. [References: 24]
机译:通过恒定的温度和恒定的压力分子动力学模拟,研究了在宽的成分范围内高于或低于熔融温度的液态Au-Cu合金的密度和比热。合金的原子相互作用用嵌入原子法(EAM)描述。根据退火时的结晶-液状夹心结构的生长方向的变化来评价平衡熔融温度。 Au-Cu合金的模拟密度随温度的降低而线性增加,而比热在900-1900 K的整个温度范围内保持恒定。过量体积是根据Au-Cu合金的预测密度计算的。过量体积的负值和比热的指数浓度依赖性表明,Neumann-Kopp规则不适用于Au-Cu二元合金体系。 [参考:24]

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