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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Modelling vacuum ultraviolet photon penetration depth and C=O bond depletion in 193nm photoresist
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Modelling vacuum ultraviolet photon penetration depth and C=O bond depletion in 193nm photoresist

机译:模拟193nm光刻胶中的真空紫外光子穿透深度和C = O键损耗

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摘要

Vacuum ultraviolet (VUV) photons are known to modify the bulk chemical composition of 193 nm photoresist, typically penetrating -100 nm and depleting carbon–oxygen bonds.Fourier transform infrared transmission measurements as a function of VUV photon fluence demonstrate that VUV-induced bond breaking occurs over a period of time. We present a model based on the idea that VUV photons initially deplete near-surface O-containing bonds,leading to deeper, subsequent penetration and more bond losses, until the remaining near-surface C–C bonds are able to absorb the incident radiation. Fitted model photoabsorption cross-sections compare well with the literature values.
机译:众所周知,真空紫外(VUV)光子会改变193 nm光致抗蚀剂的整体化学成分,通常会穿透-100 nm并耗尽碳氧键。傅立叶变换红外透射率测量值是VUV光子注量的函数,表明VUV诱导的键断裂会在一段时间内发生。我们提出一个基于以下思想的模型:VUV光子最初会耗尽近表面含O的键,从而导致更深,随后的渗透和更多的键损失,直到其余的近表面C-C键能够吸收入射辐射。拟合模型的光吸收横截面与文献值比较良好。

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