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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Structural evolution of nanoporous silica thin films studied by positron annihilation spectroscopy and Fourier transform infrared spectroscopy
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Structural evolution of nanoporous silica thin films studied by positron annihilation spectroscopy and Fourier transform infrared spectroscopy

机译:正电子an没光谱和傅里叶变换红外光谱研究纳米多孔二氧化硅薄膜的结构演变

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摘要

Three series of silica thin films with thicknesses in the 300 nm range were deposited by spin coating on Si substrates using different compositions of the sol precursors. Film samples were thermally treated in static air at temperatures ranging from 300 to 900 degrees C. The effect of sol precursors and thermal treatment temperature on the film porosity was analysed by Fourier transform infrared ( FTIR) spectroscopy, depth profiling with positron annihilation spectroscopy ( DP- PAS) and the analysis of the capacitance - voltage ( C - V) characteristic. The maximum of the total porosity was found to occur at a temperature of 600 degrees C when removal of porogen and OH groups was completed. Film densification due to the collapsing of the pores was observed after drying at 900 degrees C. DP- PAS provides evidence that the increase in the total porosity is related to a progressive increase in the pore size. The increase in the pore size never gives rise to the onset of connected porosity. In the silica film samples prepared using a low acidity sol precursor, the pore size is always lower than 1 nm. By increasing the acid catalyst ratio in the sol, larger pores are formed. Pores with size larger than 2.3 nm can be obtained by adding porogen to the sol. In each series of silica film samples the shift of the antisymmetric Si - O - Si transversal optical ( TO3) mode upon thermal treatment correlates with a change of the pore size as evidenced by DP- PAS analysis. The pore microstructure of the three series of silica films is different at all the examined treatment temperatures and depends on the composition of the precursor sol.
机译:通过使用溶胶前体的不同组成,通过旋涂将三个系列的厚度在300 nm范围内的二氧化硅薄膜沉积在Si基板上。在静态空气中于300至900摄氏度的温度下对膜样品进行热处理。通过傅立叶变换红外(FTIR)光谱,正电子an没光谱(DP)进行深度分析,分析了溶胶前体和热处理温度对膜孔隙率的影响。 -PAS)和电容-电压(C-V)特性分析。当完成成孔剂和OH基的去除时,发现总孔隙率的最大值在600℃的温度下发生。在900摄氏度下干燥后,观察到由于孔隙塌陷而引起的薄膜致密化。DP-PAS提供了证据,表明总孔隙率的增加与孔隙大小的逐步增加有关。孔径的增加决不会引起连通孔隙的产生。在使用低酸度溶胶前体制备的二氧化硅膜样品中,孔径始终小于1 nm。通过增加溶胶中的酸催化剂比率,形成较大的孔。可以通过向溶胶中添加成孔剂来获得孔径大于2.3 nm的孔。在每个系列的二氧化硅膜样品中,热处理后反对称Si-O-Si横向光学(TO3)模式的移动与孔径的变化相关,如DP-PAS分析所证明的。在所有检查的处理温度下,三个系列的二氧化硅膜的孔微结构均不同,并且取决于前体溶胶的组成。

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