Photosensitive Materials with Novel Phenolic Resins

摘要

Phenolic resin has been widely used as materials for mold resin, insulating materials, adhesives, or photoresist etc. in machinery, engineering, or semiconductor field, because of its excellent electrical insulation properties, acid resistance, heat resistance, water and fire resistance, with low cost [1]. On the other hand, phenolic resin has the disadvantage of fragility. Until now, in order to improve toughness of phenolic resin, various methods are applied, such as modification by drying oil, addition of natural rubber or NBR, reinforcement by grass fiber etc., but these methods were incompatible with heat resistance or moldability [1,2].