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Resist hardening by electron beam irradiation analyzed by atomic force microscope

机译:原子力显微镜分析电子束辐照引起的抗蚀硬化

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摘要

As increasing integration density of memory device, improvement of etching resistance of micro resist pattern has been recognized as one important problem. Generally, in order to enhance the etching resistance of resist material, electron beam (EB) irradiation has been accomplished effectively. Meanwhile, by the development of atomic force microscope (AFM), analytical precision of surface nature and its application range were improved substantiall. [1] In this regard, Matthewson reported the adhesion property of thin film on substrate analyzed by micro shere indentation. [2] Authors have already analyzed the thermal hardening mechanism by using a micro cantilever tip. [3] In this paper, the resist hardening by the EB irradiation is quantitatively detected and analyzed with micro cantilever tip.
机译:随着存储装置的集成密度的提高,已经意识到改善微抗蚀剂图案的耐蚀刻性是重要的问题。通常,为了提高抗蚀剂材料的耐蚀刻性,已经有效地完成了电子束(EB)的照射。同时,通过原子力显微镜的发展,表面性质的分析精度及其应用范围得到了极大的提高。 [1]在这方面,马修森(Matthewson)报告了通过微刻痕压痕分析的薄膜在基材上的粘附性能。 [2]作者已经使用微悬臂尖端分析了热硬化机理。 [3]在本文中,使用微悬臂梁尖端定量检测并分析了EB辐照引起的抗蚀剂硬化。

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