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Preparation and Properties of Porous Polyimide Films Prepared from a Polymer Blends of Polyol and Poly(amide acid)

机译:由多元醇和聚(酰胺酸)的聚合物共混物制备的多孔聚酰亚胺膜的制备和性能

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摘要

Porous polyimide films were prepared by thermally treating a polymer blend film of polyol and poly(amide acid) obtained from pyromellitic dianhydride (PMDA) and oxydianiline (ODA). Upon thermal treatment of the films at 300 to 400 t , the thermally less stable polyol domains decomposed, leaving porous polyimide films. The presence of pores was confirmed from the scanning electron microscope (SEM) of the surface and the cross-section of the films. The size distribution of the pore was narrow. With the increase of polyol content, the average pore size increased from 2-3 ~m to 6-7 ~m. The porous polyimide films had excellent physical properties in spite of the porous structure. Viscoelastic analyses showed that all the porous polyimide films had high glass transition temperature at above 400t, and storage moduli were maintained up to 400 t .Carbonization of the porous polyimide films at 900 t for I h gave porous carbon films maintaining the pore structure.
机译:多孔聚酰亚胺膜是通过对由均苯四甲酸二酐(PMDA)和二苯二胺(ODA)制得的多元醇和聚(酰胺酸)的聚合物共混物膜进行热处理而制备的。在300-400t下对膜进行热处理时,热稳定性较差的多元醇域分解,留下多孔聚酰亚胺膜。由膜的表面和横截面的扫描电子显微镜(SEM)确认孔的存在。孔的尺寸分布狭窄。随着多元醇含量的增加,平均孔径从2-3μm增加到6-7μm。尽管多孔结构,但聚酰亚胺多孔膜仍具有优异的物理性能。粘弹性分析表明,所有多孔聚酰亚胺膜均具有高于400t的高玻璃化转变温度,并且储能模量保持在400t以上。多孔聚酰亚胺膜在900t的条件下碳化1小时,得到的碳多孔膜保持了孔结构。

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