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Microstructures and properties of ultrafine-grained tungsten produced by equal-channel angular pressing at low temperatures

机译:低温下等通道角向挤压生产超细晶粒钨的组织和性能

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The ultrafine-grained tungsten was fabricated by equal-channel angular pressing (ECAP) at 800 °C and 950°C, respectively, and was characterized by electron microscopy and Vickers microhardness measurement. The average grain size of W decreases with the increasing number of ECAP extrusion passes and can be refined from the initial value of about 6 μm to 0.9 μm after two ECAP extrusion passes at 800°C, while it is refined to 1.5 μm after three ECAP extrusion passes at 950°C. Small angle tilt grain boundaries consisting of edge dislocations are formed in the 950°C extrusion. Intergranular fracture mode dominates the fracture failure of the W after 800°C extrusion while transgranular facture mode together with intergranular fracture mode play an important role in the fracture failure of the W after 950°C extrusion. The Vickers microhardness increases from about 510 HV for the as-received W to about 560 HV for the W extruded at both 800°C and 950°C. However, the thermal conductivity was affected only a little by the ECAP processing.
机译:分别通过等通道角挤压(ECAP)在800°C和950°C下制备超细晶粒钨,并通过电子显微镜和维氏显微硬度测量对其进行表征。 W的平均晶粒度随着ECAP挤压次数的增加而减小,可以在800°C两次ECAP挤压后从初始值约6μm细化到0.9μm,而在3个ECAP挤压后可以细化到1.5μm挤出在950℃下通过。由边缘位错组成的小角度倾斜晶粒边界是在950°C挤压过程中形成的。晶间断裂模式主导了800℃挤压后W的断裂破坏,而晶间断裂模式和晶间断裂模式在950℃挤压后W的断裂破坏中起着重要的作用。维氏显微硬度从接收的W的约510 HV增加到在800°C和950°C挤出的W的约560 HV。但是,热导率仅受ECAP处理的影响很小。

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