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Modeling of dry stiction in micro electro-mechanical systems (MEMS)

机译:微机电系统(MEMS)中的干摩擦建模

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摘要

Stiction, a term commonly used in micro electro-mechanical systems (MEMS) to refer to adhesion, is a major failure mode in MEMS. Undesirable stiction, which results from contact between surfaces, can severely compromise the reliability of MEMS. In this paper, a model is developed to predict the dry stiction between uncharged micro parts in MEMS. In dry stiction the interacting surfaces are assumed to be either hydrophobic or placed in a dry environment. In this condition the van der Waals (vdW) and asperity deformation forces are dominant. Here a model is developed for the vdW force between rough micro surfaces, and the new model is combined with a newly developed multiple asperity point model for the elastic/plastic deformation of rough surfaces in contact to solve the equilibrium condition of the forces. This in turn will yield the equilibrium distance between micro surfaces, using which the apparent work of adhesion can be found. The theory result is compared with the available experimental data from the literature. The developed model can be easily used for design purposes. If the topographic data and material constants are known, the desirable adhesion parameters can be quickly found from the model.
机译:粘滞是微机电系统(MEMS)中常用于指代粘附力的术语,是MEMS中的主要故障模式。由于表面之间的接触而产生的不希望的摩擦会严重损害MEMS的可靠性。在本文中,开发了一个模型来预测MEMS中不带电的微零件之间的干静摩擦。在干摩擦中,相互作用的表面被认为是疏水的或置于干燥的环境中。在这种情况下,范德华力(vdW)和粗糙变形力占主导。在这里,为粗糙的微表面之间的vdW力开发了一个模型,并将新模型与新开发的多重粗糙点模型相结合,以处理接触的粗糙表面的弹性/塑性变形,以解决力的平衡条件。反过来,这将产生微表面之间的平衡距离,通过该平衡距离可以发现表观的粘附力。将理论结果与文献中可获得的实验数据进行比较。开发的模型可以轻松用于设计目的。如果已知地形数据和材料常数,则可以从模型中快速找到所需的附着力参数。

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