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首页> 外文期刊>Journal of Micromechanics and Microengineering >Three-dimensional low-temperature co-fired ceramic shells for miniature systems applications
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Three-dimensional low-temperature co-fired ceramic shells for miniature systems applications

机译:微型系统应用中的三维低温共烧陶瓷外壳

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摘要

Low-temperature co-fired ceramic (LTCC) tapes (DuPont, 951 series), originally developed for monolithic packaging of interconnects and hybrid microelectronic circuitry, have been used in the past five years to develop a meso-scale integrated fluidic technology. The LTCC fluidic technology is shown to be versatile, inexpensive, fast, and free of packaging problems. The manufacturing basis for this technology is the patterning of individual tapes, which are laminated and co-fired to create a layered three-dimensional (3D) structure. In this paper, we present another attractive facet of this technology by creating 3D shell structures with a single layer of LTCC tape. The processing technique is illustrated with actuated hemispherical and cylindrical shells that have internal 3D conduits. In order to demonstrate the application of an active device using magnetostatically actuated curved LTCC shells we also present a novel three degrees-of-freedom spherical stepper motor. [References: 19]
机译:低温共烧陶瓷(LTCC)胶带(杜邦(DuPont),951系列)最初是为互连和混合微电子电路的单片包装而开发的,在过去五年中已用于开发中尺度集成流体技术。 LTCC流体技术被证明是通用的,便宜的,快速的,并且没有包装问题。这项技术的制造基础是对单个胶带进行构图,将其层叠并共烧,以形成分层的三维(3D)结构。在本文中,我们通过使用单层LTCC磁带创建3D外壳结构,展示了该技术的另一个吸引人的方面。用具有内部3D导管的半球形和圆柱形驱动壳说明了该处理技术。为了演示使用静磁致动弯曲LTCC外壳的有源设备的应用,我们还提出了一种新颖的三自由度球形步进电机。 [参考:19]

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