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Generation and annealing kinetics of current induced metastable defects in amorphous silicon alloys

机译:非晶硅合金中电流诱导的亚稳态缺陷的产生和退火动力学

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摘要

Large, rapid changes in the conductivity of hydrogenated amorphous silicon alloy metal-semiconductor-metal thin film diodes following current stressing have been reported. A model relating the change of current through a diode with defect generation and stressing current is shown to be in agreement with experiment. By using current induced conductivity as a means to monitor defect formation we show that the rate of defect production and annealing in siliconrich a-Si1-xCx:H is much faster than it is in a-Si1-xNx:H with a similar band gap. Further, the generation rate is dependent on band gap while the annealing rate is not. From measurements of the attempt to escape frequency, v, we conclude that the defects in a-Si1-xNx:H an similar to those in a-Si:H but in a-Si1-xCx:H the dominant defect is different and probably related to weak bonding cofigurations involving carbon. (C) 2000 Elsevier Science B.V. All rights reserved. [References: 20]
机译:据报道,在电流应力作用下,氢化非晶硅合金金属-半导体-金属薄膜二极管的电导率发生了较大的快速变化。结果表明,通过二极管的电流变化与缺陷产生和应力电流相关的模型与实验相符。通过使用电流感应电导率作为监测缺陷形成的方法,我们表明,在具有相似带隙的富硅a-Si1-xCx:H中,缺陷产生和退火的速度要比在a-Si1-xNx:H中更快。 。此外,生成速率取决于带隙,而退火速率不取决于带隙。通过对逃逸频率v的尝试测量,我们得出结论,a-Si1-xNx:H中的缺陷类似于a-Si:H中的缺陷,但在a-Si1-xCx:H中,主要缺陷是不同的,并且可能与涉及碳的弱键合结构有关。 (C)2000 Elsevier Science B.V.保留所有权利。 [参考:20]

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