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Arrays of un-cooled micro-bolometers based on amorphous silicon-germanium thin films deposited by plasma

机译:基于等离子体沉积的非晶硅锗薄膜的非冷却微辐射热计阵列

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摘要

We report the study of a fabrication process and characterization of one (1 D) dimensional arrays of un-cooled micro-bolometers based on amorphous silicon-germanium thermo-sensing films deposited by a low frequency PECVD at low temperature and fully compatible with the IC fabrication technology. Two different thermo-sensing films have been employed in the micro-bolometer arrays, an intrinsic film a-SixGey:H and a boron alloy a-SixGeyBz:H. The 1D array is composed of 32 elements. The active area of the cells in the array is A(b) = 70 x 66 mu m(2) and the area of the array including interconnection lines and pads is A(A) = 1.6 x 3.1 mm(2). The temperature dependence of conductivity sigma(T), current-voltage characteristics I(U) and spectral noise density have been measured in the micro-bolometer arrays with both types of thermo-sensing films in order to characterize and compare their performance characteristics, such as responsivity R and detectivity D*.
机译:我们报告了基于低温PECVD在低温下沉积且与IC完全兼容的非晶硅锗热敏膜的非冷却微辐射热计的一维(1 D)维阵列的制造工艺和表征的研究制造技术。在微辐射热计阵列中采用了两种不同的热敏膜,即本征膜a-SixGey:H和硼合金a-SixGeyBz:H。一维数组由32个元素组成。阵列中单元的有效面积为A(b)= 70 x 66μm(2),包括互连线和焊盘的阵列面积为A(A)= 1.6 x 3.1 mm(2)。为了表征和比较它们的性能特征,已经在具有两种类型的热敏膜的微辐射热计阵列中测量了电导率sigma(T),电流-电压特性I(U)和频谱噪声密度的温度依赖性。作为响应度R和检测度D *。

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