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首页> 外文期刊>Journal of new materials for electrochemical systems >Growth and characterization of electroplated copper selenide thin films
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Growth and characterization of electroplated copper selenide thin films

机译:电镀硒化铜薄膜的生长与表征

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摘要

Copper Selenide thin films have been prepared on indium doped tin oxide coated conducting glass substrates from an aqueous electrolytic bath consists of CuSO_4 and SeO_2 using potentiostatic electrodeposition technique. Deposition mechanism has been analyzed using cyclic voltammetry. X-ray diffraction pattern showed that the prepared films possess polycrystalline nature with hexagonal structure. Film composition and surface morphology showed that films with smooth surface and better stoichiometry are obtained under optimized condition. Band gap value of the deposited films is determined using optical absorption measurements. Variation of film thickness with time and its dependency on structural, morphological, compositional and optical properties are investigated.
机译:使用恒电位电沉积技术,在由CuSO_4和SeO_2组成的水电解浴中,在掺有铟的氧化锡涂层的导电玻璃基板上制备了硒化铜薄膜。使用循环伏安法分析了沉积机理。 X射线衍射图谱表明,制备的薄膜具有六方结构的多晶性质。膜组成和表面形貌表明,在最佳条件下可获得具有光滑表面和理想化学计量的膜。使用光吸收测量来确定沉积膜的带隙值。研究了膜厚度随时间的变化及其对结构,形态,组成和光学性质的依赖性。

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