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首页> 外文期刊>Journal of Materials Chemistry, A. Materials for energy and sustainability >Cost-effective fabrication of high-performance flexible all-solid-state carbon micro-supercapacitors by blue-violet laser direct writing and further surface treatment
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Cost-effective fabrication of high-performance flexible all-solid-state carbon micro-supercapacitors by blue-violet laser direct writing and further surface treatment

机译:通过蓝紫色激光直接写入和进一步的表面处理,经济高效地制造高性能的柔性全固态碳微型超级电容器

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摘要

A facile and cost-effective method for the fabrication of all-solid-state flexible carbon micro-supercapacitors (MSC) was demonstrated by laser direct writing on polyimide (PI) sheets with a compact and low-cost 405 nm semiconductor blue-violet laser, the beam of which was almost totally absorbed in the PI sheet. The obtained MSCs exhibit high performances due to the hierarchical porous structures and large thickness. Furthermore, surface treatment by air-plasma etching was employed to improve the contact interface between the carbon structures and the electrolyte, which may also influence pore structures, thus largely enhancing the MSC performance. The typical MSCs after plasma treatment for 100 s show an improved specific capacitance as high as 18.3 mF cm(-2) at a scan rate of 10 mV s(-1) and 31.9 mF cm(-2) at a current density of 0.05 mA cm(-2), both of which are higher than most of the carbon material-based MSCs reported till now. Moreover, the MSCs show good flexibility, long-time cycle stability, as well as temperature tolerance up to 80 degrees C. In addition, the voltage and capacitance can be scaled up by simply connecting a single MSC in series, parallel or both. The facile fabrication, low cost, and good performance make carbon-based MSCs fabricated by semiconductor laser direct writing promising candidates for on-chip energy storage devices.
机译:通过使用紧凑且低成本的405 nm半导体蓝紫色激光在聚酰亚胺(PI)板上进行激光直接写入,证明了一种制造全固态柔性碳微超级电容器(MSC)的简便且经济高效的方法。 ,其光束几乎完全被PI薄板吸收。所获得的MSC由于分级的多孔结构和较大的厚度而表现出高性能。此外,通过空气等离子蚀刻的表面处理被用来改善碳结构和电解质之间的接触界面,这也可能影响孔结构,从而大大增强了MSC的性能。经过等离子处理100 s后的典型MSC在10 mV s(-1)和31.9 mF cm(-2)的扫描速率和0.05的电流密度下显示出改善的比电容,高达18.3 mF cm(-2) mA cm(-2),两者均高于迄今为止报道的大多数基于碳材料的MSC。而且,MSC具有良好的灵活性,长期的循环稳定性以及高达80摄氏度的温度耐受性。此外,通过简单地串联,并联或同时连接单个MSC,就可以扩大电压和电容。轻巧的制造,低成本和良好的性能使通过半导体激光器直接写成有希望的候选片上储能器件的碳基MSC成为可能。

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