首页> 外文期刊>Journal of nanoscience and nanotechnology >Optical Properties of Silicon Semiconductor-Supported Gold Nanoparticles Obtained by Sputtering
【24h】

Optical Properties of Silicon Semiconductor-Supported Gold Nanoparticles Obtained by Sputtering

机译:通过溅射获得的硅半导体支撑的金纳米粒子的光学性质

获取原文
获取原文并翻译 | 示例
           

摘要

Gold nanoclusters are deposited directly on silicon by sputtering of a target of metallic gold using an argon plasma to provide a semiconductor-based plasmonic platform. The effects of annealing and substrate temperatures during the nanoparticles deposition and of the silicon surface energy on the shape of the nanoparticles and resulting surface plasmon resonance are investigated. The Au nanoparticles are characterized optically, structurally and morphologically using spectroscopic ellipsometry, transmission electron microscopy and atomic force microscopy to establish a correlation among the Au/Si interface reactivity, the Au nanoparticles shape and plasmonic resonance properties. It is found that post-growth annealing up to 600℃ of nanoparticles deposited at 60℃ causes aggregation of nanoparticles. Increasing the temperature of the substrate during the sputtering of gold on Si yields pancake-like nanoparticles with a large Si/Au interface reactivity forming a goldsilicides interface layer. The O_2 plasma treatment of the Si surface forming a thin intentional SiO_2 interface layer prevents the Au/Si interdiffusion yielding polyedrical nanoparticles whose plasmon resonance can be shifted down to 1.5 eV.
机译:通过使用氩等离子体溅射金属金靶,可以将金纳米团簇直接沉积在硅上,从而提供基于半导体的等离子体平台。研究了纳米粒子沉积过程中的退火温度和衬底温度以及硅表面能对纳米粒子形状和所产生的表面等离子体共振的影响。使用光谱椭偏仪,透射电子显微镜和原子力显微镜对金纳米颗粒进行光学,结构和形态表征,以建立金/硅界面反应性,金纳米颗粒形状和等离子体共振特性之间的相关性。发现在60℃下沉积至600℃的纳米颗粒的生长后退火引起纳米颗粒的聚集。在将金溅射到Si上的过程中,提高基材的温度会产生具有大的Si / Au界面反应性的煎饼状纳米颗粒,从而形成金硅化物界面层。对形成有意的SiO_2界面薄层的Si表面进行O_2等离子体处理可防止Au / Si相互扩散,从而产生多等离子体纳米粒子,其等离子体共振可降低至1.5 eV。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号