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Few-Layer Graphene Direct Deposition on Ni and Cu Foil by Cold-Wall Chemical Vapor Deposition

机译:冷壁化学气相沉积法在Ni和Cu箔上几层石墨烯直接沉积

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摘要

We report an alternative synthesis process, cold-wall thermal chemical vapor deposition (CVD), is replied to directly deposit single-layer and few-layer graphene films on Ar plasma treated Ni and Cu foils using CH_4 as carbon source. Through optimizing the process parameters, large scale single-layer graphene grown on Ni foil is comparable to that grown on Cu foil. The graphene films were able to be transferred to other substrates such as SiO_2/Si, flexible transparent PET and verified by optical microscopy, Raman microscopy and scanning electron microscopy. The sheet resistance and transmission of the transferred graphene films on PET substrate were also discussed.
机译:我们报告了另一种合成工艺,即冷壁热化学气相沉积(CVD),该工艺可以使用CH_4作为碳源在Ar等离子体处理的Ni和Cu箔上直接沉积单层和几层石墨烯薄膜。通过优化工艺参数,在镍箔上生长的大规模单层石墨烯可与在铜箔上生长的大规模单层石墨烯相媲美。石墨烯薄膜能够转移到其他基材上,例如SiO_2 / Si,柔性透明PET,并通过光学显微镜,拉曼显微镜和扫描电子显微镜进行验证。还讨论了PET基底上转移的石墨烯薄膜的薄层电阻和透射率。

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