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Large scale copper microstructures generation using electro-deposition through nuclear track filters

机译:通过核径迹过滤器的电沉积产生大规模的铜微结构

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摘要

Microstructure fabrication is not only of immense importance for microelectronics technology but also plays a vital role as a potent tool for carrying out investigations relating to behavior of materials at sub micron scales. In the recent years, it has broadened to encompass more and more areas of multidiscipline. A variety of possible applications include high power microwave generation, ultra fast computer and tetra hertz amplifier devices fabrication, radiation and temperature insensitive electronics. Fields where well-established applications already exist include field emitters; electrochemistry; conductive polymer nanofibers fabrication; transparent metal structures and macroscopic quantum tunneling phenomena. Of the many possible geometrical shapes and growth patterns, the simplest structure is probably an ensemble of wires. A variety of techniques like optical, X-rays, electron and ion beam lithography have been used for fabrication of such ensembles. However, electrochemical methods involving electrodeposition of metals into the etched pores of nuclear track filters (NTFs) of mica and polymers, are a convenient and simple technique [1-6].
机译:微结构制造不仅对微电子技术极为重要,而且作为进行与亚微米级材料行为有关的研究的有效工具也起着至关重要的作用。近年来,它已经扩展到涵盖越来越多的多学科领域。各种可能的应用包括产生高功率微波,超快计算机和四赫兹放大器设备的制造,辐射和温度不敏感的电子产品。已经存在完善应用程序的领域包括场发射器;电化学导电聚合物纳米纤维的制造;透明金属结构和宏观量子隧穿现象。在许多可能的几何形状和生长模式中,最简单的结构可能是导线的集合。诸如光学,X射线,电子和离子束光刻的各种技术已被用于制造这种整体。然而,涉及将金属电沉积到云母和聚合物的核径迹过滤器(NTF)的蚀刻孔中的电化学方法是一种方便且简单的技术[1-6]。

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