Ductility and stress relaxation kinetics in a silicon nitride ceramic in the 1400-1650 degrees C range

Testu S.; Rouxel T.; Bernard-Granger G.; Besson JL.

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Ductility and stress relaxation kinetics in a silicon nitride ceramic in the 1400-1650 degrees C range

机译：氮化硅陶瓷在1400-1650摄氏度范围内的延展性和应力松弛动力学

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来源
《Journal of Materials Science Letters》 |2000年第11期|共4页
作者
Testu S.; Rouxel T.; Bernard-Granger G.; Besson JL.;
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原文格式 PDF
正文语种 eng
中图分类工程材料学;
关键词
Glass-transition; Behavior; Creep;

机译：玻璃化转变;行为;蠕变;

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专利

1. Ductility and stress relaxation kinetics in a silicon nitride ceramic in the 1400-1650 degrees C range [J] . Testu S., Rouxel T., Bernard-Granger G., Journal of Materials Science Letters . 2000,第11期

机译：氮化硅陶瓷在1400-1650摄氏度范围内的延展性和应力松弛动力学
2. Compressive creep behaviour of Yb4Si2O7N2 containing silicon nitride ceramic between 1400 and 1500 degrees C [J] . Guo S., Hirosaki N., Nishimura T., Materials Science and Technology: MST: A publication of the Institute of Metals . 2003,第4期

机译：Yb4Si2O7N2含氮化硅陶瓷在1400至1500摄氏度之间的压缩蠕变行为
3. R-CURVES OF AN YTTRIA- AND ALUMINA-DOPED HOT-PRESSED SILICON NITRIDE CERAMIC AT 1200-DEGREES-C AND ROOM TEMPERATURE [J] . Bodur CT. Journal of Materials Science . 1995,第4期

机译：室温和室温下，氧化钇和铝掺杂的热压氮化硅陶瓷的R曲线
4. Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 deg C Range [C] . S.Testu, J.L.Besson International Conference on Creep and Fracture of Engineering Materials and Structures . 2000

机译：在1400-1650℃的高纯度氮化硅陶瓷中压缩蠕变和应力松弛动力学
5. Creep and mechanical behavior of silicon nitride whisker-reinforced silicon nitride composite ceramics. [D] . da Costa Neto, Celio Albano. 1996

机译：氮化硅晶须增强的氮化硅复合陶瓷的蠕变和力学性能。
6. Wear Simulation of Ceramic-on-Crosslinked Polyethylene Hip Prostheses: A New Non-Oxide Silicon Nitride versus the Gold Standard Composite Oxide Ceramic Femoral Heads [O] . Makiko Yorifuji, Saverio Affatato, Toshiyuki Tateiwa, 2020

机译：陶瓷上交联聚乙烯髋关节假体的磨损模拟：一种新的非氧化物氮化硅与金标准复合氧化物陶瓷股头
7. Crack-free processing of hot-pressed silicon nitride ceramics using pulsed YAG laser. (2nd report. Analysis on transient thermal stress and crack formation mechanism in laser-processing of silicon nitride ceramics). [O] . Noboru MORITA, Takehiro WATANABE, Yoshitaro YOSHIDA 1991

机译：使用脉冲YAG激光加工热压氮化硅陶瓷的无裂缝处理。（第2次报告。氮化硅陶瓷激光加工瞬态热应力和裂纹形成机理分析。
8. Stress relaxation of silicon nitride at elevated temperatures [R] . Wereszczak, A. A. , Ferber, M. K. , Kirkland, T. P. , 1995

机译：在高温下应力松弛氮化硅

Ductility and stress relaxation kinetics in a silicon nitride ceramic in the 1400-1650 degrees C range

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