Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates

摘要

Solders are used extensively in IC packages as electrical and mechanical connections. The reliability of solder joints is one of the key issues of the electronics industry. Under normal working conditions, creep and creep fatigues under thermal and cyclic thermal loads are the major failure modes. Many investigations have been carried out to understand these modes from a microstructure point of view, e.g. studies by Gravis et al. [1], Mei et al. [2] and Frear et al. [3] on grain boundary sliding and matrix dislocations. Recently, the effect of grain size or phase size has been studies by Yi et al. [4] With temperature as a variable. Although all these studies considered viscoplasticity of the material, the strain rate remained in the quasi-static and low-rate regimes, typically in the range of 10~(-4) s~(-1) to 10~(-1) s~(-1).