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首页> 外文期刊>Journal of Low Temperature Physics >Development of Superconducting Multilayer Wiring for Large Arrays of TES X-Ray Microcalorimeters
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Development of Superconducting Multilayer Wiring for Large Arrays of TES X-Ray Microcalorimeters

机译:大型TES X射线微热量计阵列超导多层布线的开发

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摘要

We are developing TES (Transition Edge Sensor) X-ray Microcalorimeters for future X-ray astronomy missions such as DIOS (Diffuse Intergalactic Oxygen Surveyor). Standard wiring for a large-format array requires narrow and closely-packed configuration. This can cause deleterious crosstalk especially in the Frequency Domain Multiplexing readout. Hence we have employed multilayer wiring technique. In this paper, we tested a deposition of a TES film on the multilayer wiring by sputtering. Our first trial showed that the TES pixels have large residual resistances >50 m(OMEGA) and small critical currents of <1 (mu)A. To improve the coverage of the TES film on the wiring, we increased the thickness of TES film (Ti/Au thickness of 100/200 nm). Also to remove an oxidation layer on the Al wiring, we strengthened a reverse-sputtering (150 W, 3 min) before the sputtering of TES. After these treatments, the TES film showed a sharp transition with small residual resistance (approx1 m(OMEGA)) and large critical current (>30 (mu)A).
机译:我们正在开发TES(过渡边缘传感器)X射线微热量计,以用于未来的X射线天文学任务,例如DIOS(漫射星系间氧气测量仪)。大型阵列的标准接线需要狭窄且紧凑的配置。这会导致有害的串扰,尤其是在频域复用读数中。因此,我们采用了多层布线技术。在本文中,我们测试了通过溅射在多层布线上沉积TES膜的情况。我们的第一个试验表明,TES像素的剩余电阻大于50 m(OMEGA),临界电流小于1μA。为了提高TES膜在布线上的覆盖率,我们增加了TES膜的厚度(Ti / Au厚度为100/200 nm)。另外,为了去除Al布线上的氧化层,我们在进行TES溅射之前加强了反向溅射(150 W,3分钟)。经过这些处理后,TES膜表现出急剧的转变,残留电阻小(约1 m(OMEGA)),临界电流大(> 30μA)。

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