Cyber-Physical Thermal Management of 3D Multi-Core Cache-Processor System with Microfluidic Cooling

摘要

Existing three-dimensional (3D) integration of multi-core processor-cache system is confronted with the problem of die thermal run-away hazard. This teething problem is addressed by a real-time demand-based thermal management with non-uniform microfluidic cooling in this paper. A novel runtime temperature management is implemented to predict the real-time temperature demand based on software-sensing with prediction-and-correction. A 3D thermal model is developed to cater the real-time microfluidic thermal dynamics. An autoregressive (AR) prediction with correction is implemented by Kalman filtering to predict and correct the runtime power, which is further used to calculate the future temperature demand. With this software-sensing approach, thermal management can be performed in a cyber-physical fashion with real-time sensing, prediction-and-correction and fine-grained control. Compared to the existing works using on-chip temperature sensors, our closed-loop controller with software-sensing avoids the cost of sensor implementation and deployment. Our work analyzes and predicts the fine-grained temperature profile of multi-core processor-cache system. It enables a number of microfluidic channels to be adjusted adaptively with different flow-rates to control the system temperature proactively as opposed to the static control with a uniform flow-rate for microfluidic channels. With the proposed cyber-physical temperature management scheme, it is shown that the temperature of multi-core system is suppressed below an acceptable thermal threshold. In fact, the fine-grained flow-rate control also achieves a more even temperature distribution and saves up to 72.1% of total flow-rate compared with uniform flow-rate controls.