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首页> 外文期刊>Journal of Materials Science >A COMPARATIVE STUDY OF THE COATED FILLER METHOD AND THE ADMIXTURE METHOD OF POWDER METALLURGY FOR MAKING METAL-MATRIX COMPOSITES
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A COMPARATIVE STUDY OF THE COATED FILLER METHOD AND THE ADMIXTURE METHOD OF POWDER METALLURGY FOR MAKING METAL-MATRIX COMPOSITES

机译:金属基复合材料粉末冶金填充填料方法与粉末冶金辅助方法的比较研究

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Copper-matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems,the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol % Mo, 60 vol % TiB2 and 54 vol % SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Com pared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity. [References: 10]
机译:铜基复合材料是通过粉末冶金(PM)制成的。增强材料是钼颗粒,碳化硅晶须和二硼化钛薄片。使用了涂覆填料方法,该方法包括用基质金属涂覆增强材料。相比之下,传统的粉末冶金采用混合方法,该方法涉及基质粉末和增强材料的混合物。对于所有复合材料系统,发现涂层填料方法在提供低孔隙率,更高硬度,更高抗压屈服强度,更低热膨胀系数(CTE),更高导热率和更低电阻率的复合材料方面优于混合方法。 ,尽管高含量钢筋的优势程度要高于低含量钢筋的优势程度。在涂覆填料方法中,增强材料上的涂层使增强单元彼此分离,并提供了比混合方法更干净的界面,增强材料和基体之间的结合力更强。通过涂覆填料方法制得的致密复合材料(孔隙度小于5%)中最高的增强剂含量为70体积%Mo,60体积%TiB2和54体积%SiC。通过混合法制得的复合材料的孔隙率突然增加的临界增强体积分数为60%Mo,42%TiB2和33%SiC。随着增强物的纵横比减小,该分数增加。在相同的增强体积分数(50%)的Cu / Mo,Cu / TiB2和Cu / SiC中,Cu / Mo的CTE最低,导热率和电阻率最低,而Cu / SiC的硬度和Cu / SiC最高。 TiB2和Cu / SiC具有最高的压缩屈服强度。与Cu / SiC相比,Cu / TiB2具有更高的导热率和更低的电阻率。 [参考:10]

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