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首页> 外文期刊>Journal of Materials Science >A TEM analysis of the Si3N4/Si3N4 joint with a Cu-Zn-Ti filler metal
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A TEM analysis of the Si3N4/Si3N4 joint with a Cu-Zn-Ti filler metal

机译:含Cu-Zn-Ti填充金属的Si3N4 / Si3N4接头的TEM分析

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摘要

Si3N4 ceramic was joined to itself using a filler alloy of (CuZn)(85)Ti-15 at 1123-1323 K for 15 min. TEM observation showed that a reaction zone of TiN and/or Ti2N exists at the interface between the ceramic and filler alloy, and the center of the joint is composed of Cu-Zn solid solution in which there are Cu2TiZn and Ti5Si3 reaction phases. With increasing brazing temperature, both the thickness of the reaction zone and the amount and size of the Ti5Si3 phase increase, while the amount and size of the Cu2TiZn phase decrease. When the brazing temperature reached 1323 K, the Cu2TiZn phase disappeared. When the brazing temperature is lower than 1223 K, the interfacial reaction zone is mainly composed of Ti2N, which has a cylindrical shape and orientates randomly in the zone. There is a crystal orientation relationship between the Ti2N in the reaction zone and the Cu in the Cu-Zn solid solution, which is: {110}(Ti2N)//{420}(Cu), <001>(Ti2N)//<001>(Cu). When the brazing temperature is higher than 1223 K, the interfacial zone is composed of TiN, which has a plate shape crossing each other. (C) 2004 Kluwer Academic Publishers.
机译:使用(CuZn)(85)Ti-15填充合金在1123-1323 K上将Si3N4陶瓷结合15分钟。 TEM观察表明,在陶瓷与填充合金之间的界面处存在TiN和/或Ti2N的反应区,接头中心由Cu-Zn固溶体组成,其中Cu2TiZn和Ti5Si3反应相存在。随着钎焊温度的升高,反应区的厚度以及Ti5Si3相的数量和尺寸都会增加,而Cu2TiZn相的数量和尺寸则会减小。当钎焊温度达到1323K时,Cu 2 TiZn相消失。当钎焊温度低于1223 K时,界面反应区主要由Ti2N组成,Ti2N呈圆柱形,并在该区中随机取向。反应区中的Ti2N与Cu-Zn固溶体中的Cu之间存在晶体取向关系,即:{110}(Ti2N)// {420}(Cu),<001>(Ti2N)// <001>(铜)。当钎焊温度高于1223K时,界面区域由TiN组成,其具有彼此交叉的板状。 (C)2004 Kluwer学术出版社。

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