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Bend stiffness of copper and copper alloy foils

机译:铜及铜合金箔的弯曲刚度

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摘要

Loop stiffness and permanent deflection in bend testing of tough pitch copper foil and three kinds of copper alloy foils have been evaluated as bend stiffness. The copper alloy foils, in particular precipitation-hardened NK120 and C7025, exhibited high loop stiffness. High Young's moduli of the alloy foils, which were confirmed by a cantilever resonance method, are considered to increase the elastic loop stiffness. The NK120 and C7025 also showed small permanent deflection in a cantilever bend test. The deflection, in general, decreased as 0.2 percent offset yield strength increased. However, the permanent deflections of NK120 and C7025 foils were reduced by stress-relief annealing, although the annealing lowered the yield strength in tension. Change in residual stress at the surface layer of the foil by annealing is considered to have increased the bend stiffness.
机译:韧性铜箔和三种铜合金箔在弯曲试验中的环刚度和永久挠度已被评估为弯曲刚度。铜合金箔,特别是经过沉淀硬化的NK120和C7025,表现出高的圈刚度。通过悬臂共振法确认的合金箔的高杨氏模量被认为增加了弹性环刚度。 NK120和C7025在悬臂弯曲测试中也显示出小的永久挠度。通常,挠度随着0.2%的补偿屈服强度的增加而减小。然而,尽管退火降低了张力的屈服强度,但通过应力消除退火减少了NK120和C7025箔的永久挠度。通过退火在箔的表面层处的残余应力的变化被认为增加了弯曲刚度。

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