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Fabrication of W-20 wt.%Cu alloys by powder injection molding

机译:通过粉末注射成型制造W-20 wt。%Cu合金

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W-20 wt.% Cu balls were fabricated by powder injection molding using a binder system consisted of paraffin wax, high density polyethylene, ethylene vinyl acetate and stearic acid. By optimizing the injection molding parameters, defect-free green parts were obtained. A two-step debinding process was employed to extract the binders in the molded samples. All soluble ingredients of the binders in the green parts were extracted during solvent debinding, and the residual binders can be removed in thermal debinding. The debound W-Cu samples were sintered in H_2 atmosphere at temperatures ranging 1050-1150 ℃ for 2 h. It was shown that relative density of the sintered W-Cu samples increases from 87.37% of the theoretical to 95.58% as sintering temperature rises from 1050 ℃ to 1150 ℃. Microstructures of the molded, the debound and the sintered W-Cu samples were observed by scanning electron microscope, and the sintered W-Cu balls have fine and homogeneous microstructures. Maximum compressive strength of W-Cu balls with 8.5 mm diameter reaches 58 kN.
机译:通过使用由石蜡,高密度聚乙烯,乙烯乙酸乙烯酯和硬脂酸组成的粘合剂体系,通过粉末注射成型来制造W-20重量%的Cu球。通过优化注塑参数,可以获得无缺陷的生坯。采用两步脱脂工艺来提取成型样品中的粘合剂。在溶剂脱脂过程中提取了生坯中粘合剂的所有可溶性成分,可以通过热脱脂去除残留的粘合剂。在H_2气氛中,在温度范围为1050至1150℃的条件下,将脱出的W-Cu样品烧结2 h。结果表明,随着烧结温度从1050℃升高到1150℃,烧结后的W-Cu样品的相对密度从理论值的87.37%增加到95.58%。通过扫描电子显微镜观察成型的,去粘的和烧结的W-Cu样品的微观结构,并且烧结的W-Cu球具有精细且均匀的微观结构。直径8.5 mm的W-Cu球的最大抗压强度达到58 kN。

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