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Analysis of current transients for voltage pulse-modulated surface processing: Application to anodic electro-dissolution of copper for electrochemical mechanical planarization

机译:电压脉冲调制表面处理的电流瞬态分析:在用于电化学机械平面化的铜的阳极电溶解中的应用

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摘要

The voltage pulse modulation technique is useful for electrochemical processing of metal and alloy surfaces by utilizing faradaic reactions like electro-deposition and electro-dissolution. A theoretical framework is presented here to facilitate quantitative analysis of experimental data (current transients) obtained in this approach. A typical application of this analysis is demonstrated for an experimental system involving electrochemical removal of copper surface layers, a relatively new process for abrasive-free electrochemical mechanical planarization of copper lines used in the fabrication of integrated circuits. Voltage pulse-modulated electro-dissolution of Cu in the absence of mechanical polishing is activated in an acidic solution of oxalic acid and hydrogen peroxide. The current generated by each applied voltage step shows a sharp spike, followed by a double-exponential decay, and eventually attains the rectangular shape of the potential pulses. The formulas presented here show excellent fits to these current transients, and help to probe the detailed electrochemistry of surface layer removal using a simple circuit model of the reactive interface.
机译:电压脉冲调制技术可利用法拉第反应(如电沉积和电溶解)用于金属和合金表面的电化学处理。这里提出了一个理论框架,以方便定量分析以这种方法获得的实验数据(电流瞬变)。该分析的典型应用已针对涉及电化学去除铜表面层的实验系统进行了演示,这是一种用于集成电路制造的铜线无磨擦电化学机械平面化的相对较新的工艺。在草酸和过氧化氢的酸性溶液中,可以在不进行机械抛光的情况下激活铜的电压脉冲调制电溶解。每个施加的电压阶跃产生的电流会显示一个尖峰,随后是双指数衰减,最终变为电势脉冲的矩形。此处给出的公式显示出非常适合这些电流瞬变,并使用反应性接口的简单电路模型帮助探查了去除表面层的详细电化学反应。

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