首页> 外文期刊>Journal of Materials Processing Technology >Fatigue and hardness effects of a thin buffer layer on the heat affected zone of a weld repaired Bisplate80
【24h】

Fatigue and hardness effects of a thin buffer layer on the heat affected zone of a weld repaired Bisplate80

机译:薄的缓冲层在焊接修复的Bisplate的热影响区上的疲劳和硬度影响80

获取原文
获取原文并翻译 | 示例
           

摘要

Heat-affected zones (HAZs) in extensively weld-repaired Bisplate80, or the parent metal (PM), have been studied and examined using hardness measurements in conjunction with fatigue crack growth measurements and detailed scanning electron microscopy (SEM) observations. Three different groups of specimens have been prepared, i.e. as-received PM, weld-repaired PM with a thin 4 mm BL between PM and weld metal (WM), and weld-repaired PM without BL. The extended compact tension (E-CT) specimens for fatigue measurements are prepared according to the ASTM specifications, which are also used for hardness measurements. Hardness and fatigue crack growth variations across the boundaries between WM, BL and PM have been measured together with detailed SEM observations. It has been found that the welding process without BL reduced both hardness and fatigue resistance, especially around the weld interface and within the HAZ. Incorporation of a thin soft BL between WM and PM has increased both hardness and fatigue resistance around the weld interface and within the HAZ.
机译:使用硬度测量,疲劳裂纹扩展测量和详细的扫描电子显微镜(SEM)观察,对经过广泛焊接修复的Bisplate80或母材(PM)中的热影响区(HAZ)进行了研究和检查。已准备了三组不同的试样,即按原样接收的PM,在PM与焊缝金属(WM)之间具有4mm薄BL的焊缝修补PM和无BL的焊缝修补PM。根据ASTM规范准备了用于疲劳测量的扩展紧密拉伸(E-CT)标本,该标本也用于硬度测量。已测量了WM,BL和PM边界上的硬度和疲劳裂纹扩展变化,以及详细的SEM观察结果。已经发现,没有BL的焊接过程降低了硬度和抗疲劳性,特别是在焊接界面周围和HAZ内部。在WM和PM之间加入薄而柔软的BL既增加了焊接界面周围以及HAZ内的硬度和抗疲劳性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号