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Freeform fabrication of Ti{sub}3SiC{sub}2 powder-based structures - Part I: integrated fabrication process

机译:Ti {sub} 3SiC {sub} 2粉末基结构的自由成型制造-第一部分:集成制造工艺

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摘要

Ti{sub}3SiC{sub}2 carbide represents a new class of ceramics with unique electrical and mechanical properties. This paper presents a development of using three-stage fabrication process, i.e., three-dimensional layered printing, cold isostatic pressing, and sintering processing to freeform fabrication of three-dimensional Ti{sub}3SiC{sub}2 structures with complex geometry and high density. The three-stage fabrication process and their integration are described. Results of different processes and their effects on the geometric shrinkage and structural density of fabricated Ti{sub}3SiC{sub}2 components are presented and compared. Current studies reveal that the developed three-stage process was capable of fabricating fully dense (density > 99%) structures with complex geometries based on pre-coated Ti{sub}3SiC{sub}2 powder.
机译:Ti {sub} 3SiC {sub} 2碳化物代表了具有独特的电气和机械性能的新型陶瓷。本文提出了利用三维分层印刷,冷等静压和烧结工艺三阶段制造工艺的发展,以自由制造具有复杂几何形状和高强度的三维Ti {sub} 3SiC {sub} 2结构密度。描述了三阶段制造过程及其集成。提出并比较了不同工艺的结果及其对所制造的Ti {sub} 3SiC {sub} 2组件的几何收缩和结构密度的影响。当前的研究表明,基于预涂覆的Ti {sub} 3SiC {sub} 2粉末,已开发的三阶段工艺能够制造具有复杂几何形状的完全致密(密度> 99%)结构。

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