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Grain Size Determination of Copper Film by Electron Backscatter Diffraction

机译:电子背向散射衍射测定铜膜粒径

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摘要

The grain size of a cross-section of 8 ìm-thick copper film was determined by electron backscatter diffraction analysis. Grain size distribution histogram showed the presence of a large fraction of small-sized grains, and the mean grain size was significantly affected by handling of them. A cut-off grain size, below which all grains are ignored as noise and eliminated for the calculation of the mean value, should be three or four times as large as the step size. Due to the presence of small grains, the linear intercept method derived larger mean grain size, which depends less sensitively on the cut-off grain size than the equivalent circle diameter method.
机译:通过电子背散射衍射分析确定8μm厚的铜膜的横截面的晶粒尺寸。晶粒尺寸分布直方图显示存在大量的小尺寸晶粒,平均晶粒尺寸受到处理的影响。临界粒度应小于步长大小的三倍或四倍,在该粒度下,所有晶粒都将被忽略为噪声并被消除以计算平均值。由于存在小晶粒,因此线性截距法得出的平均晶粒尺寸更大,与等效圆直径法相比,它更不敏感地取决于截止晶粒尺寸。

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