Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion of Electroless-plated Ni on Polyimide

摘要

Effects of 85 deg C/85 percent Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a 180 deg peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from 37.4 + - 5.6 g/mm to 22.0 + - 2.7 g/mm for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.