Micromechanical Analysis of the Effect of Residual Stress on the Nanoindentation Curve

摘要

A new model is presented for measuring equi-biaxial stress on thin-film using nanoindentation. The model was focused on the analysis of a depth-shift in the nanoindentation curve by stress effect. A load-controlled relaxation of the shifted indentation depth was chosen to avoid the variation of the contact area occurred in a depth-controlled relaxation. Nanoindentation experiments on (100) W single crystal at artificial equi-biaxial stress states verified that the proposed load-controlled relaxation model is capable of analyzing the residual stress within the standard deviation of +-35.9 MPa.