Pressure solution seams (PSSs) can be idealized as localized volume reduction structures (LVRSs) in terms of their mechanics. Previous mechanical analyses of LVRSs, including compaction bands, showed that the normal stresses at the tips of LVRSs are compressive and significantly amplified with respect to the remote stresses, whereas on the flanks they are slightly reduced. These results can be used to rationalize the in-plane growth of PSSs for a certain distance, however, based on these stress conditions alone, it is not possible to explain the widening and transverse coalescence of PSSs. In this study, based on laboratory and field observations that the PSS surfaces are extremely rough, we introduced asperities with triangular, semicircular, and rectangular geometries on the flanks of the LVRSs into our mechanical model to see if these asperities can raise stresses in these locations, which may rationalize the transverse growth of PSSs. It is found that these asperities can produce strong stress perturbations on the LVRS flanks thereby inducing a significant increase in the compressive normal stresses. In addition, to account for the rate factor of the pressure solution process, a creep law was adopted to simulate growth and coalescence of the LVRSs. Using the calculated normal compressive stresses and volumetric plastic strains as proxy for the growth, we show that (1) a single LVRS is able to grow both laterally and transversely for a short distance and (2) two in-plane aligned neighboring LVRSs with a short distance between the adjacent tips and two parallel echelon and overlapped LVRSs with a small spacing may be able to link and coalesce to form a longer and wider LVRS, respectively. The influences of the LVRS geometric configurations, the material properties within the LVRSs, and the distance and spacing of the aligned in-plane, echelon, and overlapping neighboring parallel LVRSs on the growth and coalescence of the LVRSs are investigated and their implications specifically for the PSSs are also discussed.
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