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首页> 外文期刊>Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena >Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board During Continuous Manufacture Procedure
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Numerical Simulation of the Stress Field of Thick 7B04 Aluminum Alloy Board During Continuous Manufacture Procedure

机译:连续制造过程中厚7B04铝合金板应力场的数值模拟

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摘要

Numerical simulation method is employed in the article to analyze the stress field of thick 7B04 aluminum alloy board during manufacturing procedure of solution treatment, calendaring and stretching. The simulation results show that the surface of the board endures cotnpressive stress while the core segment endures tensile stress, and the distribution of the stress is very inhomogeneous. The calendaring procedure helps to decrease the stress and redistribute the stress uniformly, but it also leads to stress concentration at the two ends of the board, which engenders bad influence on the subsequent processing. The board deforms plastically when being stretched, thus the stress decreases greatly and is redistributed uniformly.
机译:本文采用数值模拟的方法分析了固溶处理,压延和拉伸过程中厚7B04铝合金板的应力场。仿真结果表明,电路板的表面承受压应力,而核心部分承受拉应力,应力分布非常不均匀。压延过程有助于减小应力并均匀地重新分布应力,但同时也会导致应力集中在板的两端,从而对后续处理产生不良影响。板在拉伸时会发生塑性变形,因此应力大大降低,并且重新均匀分布。

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