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首页> 外文期刊>Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena >Effects of Cu on the Microstructures and Tensile Properties of Thixoformed Al-Si Alloys
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Effects of Cu on the Microstructures and Tensile Properties of Thixoformed Al-Si Alloys

机译:铜对触变成形铝硅合金显微组织和拉伸性能的影响

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摘要

In this study, the effects of copper content on the microstructures and tensile properties of thixoformed Al-5Si-xCu-0.5Fe (x =1.0, 2.0 and 3.0wt. %) were investigated. For this study, three different alloys having various amounts of copper were prepared using cooling slope casting before thixoforming. The semi-solid liquid range for the alloys were estimated using the diffrential scanning calorimetry (DSC) analysis. The samples were thixoformed at 40% liquid fraction. Some of these samples were treated with a T6 aging process. The thixoformed and thixoformed T6 samples were then characterized by optical microscopy, scanning electron microscope (SEM) and energy dispersiye X-ray (EDX) as well as tensile tests. The different phases formed in the thixoformed and thixoformed T6 samples were throughly investigated.The results indicate that as copper content increases, the tensile strength also increases, which might due to precipitation hardening. The thixoformed T6 alloys attained an ultimate tensile strength (UTS) as high as 303 MPa when Cu content is 3.0wt.%.
机译:在这项研究中,研究了铜含量对触变成形的Al-5Si-xCu-0.5Fe(x = 1.0、2.0和3.0wt。%)的微观结构和拉伸性能的影响。为了进行这项研究,在触变成形之前使用冷却斜铸法制备了三种具有不同铜含量的不同合金。使用差示扫描量热法(DSC)分析来估算合金的半固态液体范围。样品以40%的液体比例进行触变成型。其中一些样品经过T6时效处理。然后通过光学显微镜,扫描电子显微镜(SEM)和能量分散X射线(EDX)以及拉伸试验对触变和触变T6样品进行表征。深入研究了触变和触变T6样品中形成的不同相。结果表明,随着铜含量的增加,拉伸强度也增加,这可能是由于沉淀硬化所致。当Cu含量为3.0wt。%时,触变成型的T6合金达到了高达303 MPa的极限拉伸强度(UTS)。

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