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Faceting of Σ3 grain boundaries in Cu: three-dimensional Wulff diagrams

机译:Cu中Σ3晶界的刻面:三维Wulff图

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Diffusional growth of the grain boundaiy (GB) groove permits one to measure the ratio between GB energy σ_(GB) and surface energy σ_(sur). The faceting of twin tilt grain boundaries in Cu has been studied using the GB thermal groove method. No rough facet edges were observed. It means that melting temperature is lower than the roughening temperature for the observed facets in Cu. The influence of orientation and misorientation deviation Δθ = |θ-θ_Σ| from coincidence misorientation θ_Σ has been studied. By increase of Δθ the energy of(100)CSL facet increases. The convenient method for construction 3D three-dimensional Wulff diagrams was found. The 3-dimensional Wulff diagrams were constructed using this method and measured σ_(GB)/σ_(sur) values.
机译:晶粒边界(GB)沟槽的扩散生长允许人们测量GB能量σ_(GB)和表面能σ_(sur)之间的比率。铜中双倾斜晶界的刻面已使用GB热槽法进行了研究。没有观察到粗糙的小面边缘。这意味着熔化温度低于在Cu中观察到的刻面的粗糙化温度。取向和取向偏差的影响Δθ= |θ-θ_Σ|从重合错位θ_Σ开始进行了研究。通过增加Δθ,(100)CSL晶面的能量增加。找到了构建3D三维Wulff图的便捷方法。使用此方法构建了3维Wulff图,并测量了σ_(GB)/σ_(sur)值。

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