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The Influence of Quenching Baths on Grain Boundary Wetting Transition in Sn-25 at% In alloy

机译:淬火浴对Sn-25 at%合金中晶界润湿转变的影响

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摘要

The wetting behavior of grain boundaries is affected by temperature, pressure and misorientation of grain boundaries,. However, the influence of quenching baths on liquid state grain boundary wetting is rarely reported. In this work, this effect in the Sn-25 at% In alloy was investigated. The Sn-In alloy was prepared by smelting of In and Sn at 300°C for 6 hr in Ar atmosphere. Samples were annealed at temperature between 130 and 165°C and quenched in two kinds of baths: -10°C salt-saturated water and liquid nitrogen. The results from X-ray diffraction show a difference in preferential orientations between samples quenched in these two baths Metallographic analysis reveals that the percentage of grain boundaries fully wetted in samples quenched in -10°C salt-saturated water is lower than that quenched in liquid nitrogen. It is pointed out that a proper quenching bath is necessary for preserving the initial microstructure of grain boundary wetting.
机译:晶界的润湿行为受温度,压力和晶界取向错误的影响。然而,几乎没有报道淬火浴对液态晶界润湿的影响。在这项工作中,研究了Sn-25 at%In合金中的这种作用。通过在Ar气氛中在300℃下将In和Sn熔融6小时来制备Sn-In合金。样品在130至165°C的温度下退火,并在两种浴中淬灭:-10°C的盐饱和水和液氮。 X射线衍射的结果表明,在这两个浴中淬火的样品之间的优先取向有所不同。金相分析表明,在-10°C盐饱和水中淬火的样品中,完全浸润的晶界百分比低于在液体中淬火的晶界百分比。氮。指出了适当的淬火浴对于保持晶界润湿的初始微观结构是必要的。

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