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Intermixing in Cu/Co: molecular dynamics simulations and Auger electron spectroscopy depth profiling

机译:Cu / Co中的混合:分子动力学模拟和俄歇电子能谱深度剖析

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摘要

The ion-bombardment induced evolution of intermixing is studied by molecular dynamics simulations and by Auger electron spectroscopy depth profiling analysis (AESD) in Cu/Co multilayer. It has been shown that from AESD we can derive the low-energy mixing rate and which can be compared with the simulated values obtained by molecular dynamics (MD) simulations. The overall agreement is reasonably good hence MD can hopefully be used to estimate the rate of intermixing in various interface systems.
机译:通过分子动力学模拟和俄歇电子能谱深度剖析分析(AESD)研究了Cu / Co多层膜中离子轰击引起的混合演化。已经表明,从AESD可以推导出低能量混合速率,并且可以将其与通过分子动力学(MD)模拟获得的模拟值进行比较。总体协议是相当好的,因此MD有望用于估计各种接口系统中的混合速率。

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