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256 x 256 Focal Plane Array Midwavelength Infrared Camera Based on InAs/GaSb Short-Period Superlattices

机译:基于InAs / GaSb短周期超晶格的256 x 256焦平面阵列中波红外摄像机

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摘要

An infrared camera based on a 256 X 256 focal plane array (FPA) for the second atmospheric window (3-5 jam) has been realized for the first time with InAs/GaSb short period superlattices (SLs).The SL detector structure with a broken gap type-II band alignment was grown by molecular beam epitaxy on GaSb substrates.Effective bandgap and strain in the superlattice were adjusted by varying the thickness of the InAs and GaSb layers and the controlled formation of InSb-like bonds at the interfaces.The FPAs were processed in a full wafer process using optical lithography,chemical-assisted ion beam etching,and conventional metallization technology.The FPAs were flip-chip bonded using indium solder bumps with a read-out integrated circuit and mounted into an integrated detector cooler assembly.The FPAs with a cutoff wavelength of 5.4 mum exhibit quantum efficiencies of 30% and detectivity values exceeding 10~(13) Jones at T = 77 K.A noise equivalent temperature difference (NETD) of 11.1 mK was measured for an integration time of 5 ms using f/2 optics.The NETD scales inversely proportional to the square root of the integration time between 5 ms and 1 ms,revealing background limited performance.Excellent thermal images with low NETD values and a very good modulation transfer function demonstrate the high potential of this material system for the fabrication of future thermal imaging systems.
机译:首次使用InAs / GaSb短周期超晶格(SLs)实现了基于256 X 256焦平面阵列(FPA)的红外摄像头,用于第二个大气窗口(3-5卡纸)。通过分子束外延在GaSb衬底上生长II型断裂间隙能带排列,通过改变InAs和GaSb层的厚度以及在界面处受控形成InSb样键来调节超晶格中的有效带隙和应变。使用光学光刻,化学辅助离子束刻蚀和常规金属化技术在全晶圆工艺中对FPA进行处理。使用铟锡凸点和读出集成电路将FPA倒装芯片键合,然后将其安装到集成的探测器冷却器组件中截止波长为5.4μm的FPA的量子效率为30%,在T = 77 KA时的探测值超过10〜(13)Jones,噪声等效温度差(NETD)为11.1 mK。使用f / 2光学元件对5 ms的积分时间进行测量.NETD与5 ms到1 ms之间积分时间的平方根成反比,显示了背景受限的性能.NETD值低且质量非常好的出色热图像调制传递函数证明了该材料系统在未来热成像系统制造中的巨大潜力。

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