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首页> 外文期刊>Journal of Electronic Materials >Low-Temperature Sintering and Microwave Dielectric Properties of Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4) (Ln = Sm, Nd and La) Ceramics
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Low-Temperature Sintering and Microwave Dielectric Properties of Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4) (Ln = Sm, Nd and La) Ceramics

机译:Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4)(Ln = Sm,Nd和La)陶瓷的低温烧结和微波介电性能

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摘要

Microwave dielectric ceramics of Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4) (Ln = Sm, Nd and La) with a low firing temperature were prepared via conventional solid-state reaction. The phases and microstructures of the ceramics were characterized by x-ray diffraction and scanning electron microscopy. The temperature coefficients of resonant frequency in the three compositions increased as sintering temperature increased. It is worth noting that a phase transition of the Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4) (Ln = Sm, Nd and La) ceramics from a monoclinic to a tetragonal scheelite structure was found with an increase in sintering temperature. The densification temperatures of all compositions were below 700 degrees C. Excellent microwave dielectric properties were obtained for the Bi0.9Nd0.05Li0.05V0.9Mo0.1O4 ceramic sintered at 650 degrees C, with a dielectric constant of similar to 72.2, a quality factor of similar to 6467 GHz and a temperature coefficient of resonant frequency of similar to 2.6 ppm/degrees C. The Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4) (Ln = Sm, Nd and La) ceramics are chemically compatible with both Ag and Cu powders at their sintering temperatures, and are thus a promising candidate for use in LTCC technology applications.
机译:通过常规固相反应制备了具有低烧成温度的Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4)(Ln = Sm,Nd和La)的微波介电陶瓷。通过X射线衍射和扫描电子显微镜表征了陶瓷的相和微观结构。三种成分的共振频率温度系数随着烧结温度的增加而增加。值得注意的是Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4)(Ln = Sm,Nd和La)陶瓷从单斜晶到四方晶的相变烧结温度升高发现白钨矿结构。所有组合物的致密化温度均低于700摄氏度。在650摄氏度下烧结的Bi0.9Nd0.05Li0.05V0.9Mo0.1O4陶瓷获得了优异的微波介电性能,其介电常数接近72.2,是品质因数Bi(0.9)Ln(0.05)Li(0.05)V(0.9)Mo(0.1)O(4)(Ln = Sm)类似于6467 GHz,共振频率温度系数类似于2.6 ppm /℃。 ,Nd和La)陶瓷在烧结温度下与Ag和Cu粉末化学相容,因此是用于LTCC技术应用的有前途的候选材料。

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