Effect of Heat Treatment on the Thermoelectric Properties of Bismuth-Antimony-Telluride Prepared by Mechanical Deformation and Mechanical Alloying

摘要

In this work, p-type 20%Bi_2Te_3-80%Sb_2Te_3 bulk thermoelectric (TE) materials were prepared by mechanical deformation (MD) of pre-melted ingot and by mechanical alloying (MA) of elemental Bi, Sb, and Te granules followed by cold-pressing. The dependence on annealing time of changes of microstructure and TE properties of the prepared samples, including Seebeck coefficient, electrical resistivity, thermal conductivity, and figure-of-merit, was investigated. For both samples, saturation of the Seebeck coefficient and electrical resistivity were observed after annealing for 1 h at 380℃. It is suggested that energy stored in samples prepared by both MA and MD facilitated their recrystallization within short annealing times. The 20%Bi_2Te_3-80%Sb_2Te_3 sample prepared by MA followed by heat treatment had higher a Seebeck coefficient and electrical resistivity than specimens fabricated by MD. Maximum figures-of-merit of 3.00 × 10~(-3)/K and 2.85 × 10~(-3)/K were achieved for samples prepared by MA and MD, respectively.