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Development of a Method for Chemical-Mechanical Preparation of the Surface of CdZnTe Substrates for HgCdTe-Based Infrared Focal-Plane Arrays

机译:基于HgCdTe的红外焦平面阵列化学机械制备CdZnTe衬底表面的方法的开发

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摘要

This paper reports the first implementation in our laboratory of a chemical-mechanical polishing (CMP) process for CdZnTe (CZT) substrates prepared for growth of HgCdTe layers by liquid phase epitaxy and molecular beam epitaxy. The process enables significant reduction of the thickness of the damaged zone induced by the mechanical polishing that must be etched away before epitaxy. Resulting improvements in surface morphology, in terms of waviness and density of point defects, are reported. The chemical state of surfaces polished by CMP was characterized by x-ray photoelectron spectroscopy. The chemical state was highly homogeneous; comparison with a reference surface is reported. End use assessment of this surface processing was compared with that of reference substrates by preparation of focal-plane arrays in the medium-wavelength infrared spectral range, by using epitaxial layers grown on substrates polished by different methods. The electro-optical performance of the detectors, in terms of photovoltaic noise operability, are reported. The results reveal that the state of this CMP surface is at the level of the best commercial substrates.
机译:本文报道了在我们实验室中对CdZnTe(CZT)基板进行化学机械抛光(CMP)工艺的第一个实施方案,该工艺用于通过液相外延和分子束外延生长HgCdTe层。该方法能够显着减小由必须在外延之前蚀刻掉的机械抛光引起的损坏区域的厚度。据报道,在表面波纹度和点缺陷密度方面得到了改善。通过X射线光电子能谱表征通过CMP抛光的表面的化学状态。化学状态是高度均匀的;报告了与参考表面的比较。通过使用在通过不同方法抛光的基板上生长的外延层制备中波长红外光谱范围内的焦平面阵列,将该表面处理的最终用途评估与参考基板进行了比较。报告了探测器在光电噪声方面的光电性能。结果表明,该CMP表面的状态处于最佳商用基材的水平。

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